ModulAS, a modular die bon-der concept of Simotec, is setto achieve records in throughput: up to 7200 units per hour, twice the performance of existing systems. The modular design enables configuration for flip-chip applications and special tasks, as a single system or a combination of systems. This way, the equipment can beflexibly switched to other applications or upgraded to the desired performance by simply combining several units. Still, the main module controlsthe entire configuration. Keyto this feature is a mechanic-ally rugged, vibration-free construction, employing two linear motors. The portal toolsapproach the substrates at a precision level of 25µm (@ 4-sigma). Frame and portal are mounted perpendicular to the substrate which can be applied in sizes of up to 450mm. Dif-ferent frame versions are a-vailable, a second portal can be added. Feeding is done via wafer transport, feeder, waffle pack or SMIF boxes. PET-foil carriers can be used without loss of precision by measuring the bond pad position with a camera before dispensing adhesives and placing the chips. Equally, the alignment of the die can be controlled by an optional vision system.
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