The British National Physical Laboratory (NPL) announces the release of their report Solderability Measurements of PCB Pad Finishes and Geometries. As part of a program to investigate lead-free soldering technologies, this study was undertaken into the solderability of combinations of three lead-free formulations (SnAgCu, SnCu, SnAg), three fluxes and five PCB pad finishes (immersion Sn, immersion Ag, HASL SnPb, OSP, NiAu). The report can be ordered on line.
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