Field-array packages of all kinds are becoming the key component for the miniaturization of electronic assemblies. However, their connecting pads are no longer visible due to their flipped position. With ZelPlace BGA, LPKF has provided a tool to place these components in a precise and reliable way. A camera system with mirrors provides visibility of the terminations on the bottom side of the component, and at the same time, the footprint on the board is shown. Exact overlap of both images will be achieved with fine-detail adjustment. The zoom adjustment enables focusing of small areas up to a size of 50 x 50mm. With exchangeable nozzles, it can handle various types of components. A freely definable positioning and lowering mechanism is located on a two-axis system, and both the force and the lowering speed can be adjusted separately. The equipment has been especially designed for lab operations, but it may also be used within an automated SMT line.
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