Ergonomically designed, Metcal’s VPI-1000 manual inspection sys-tem offers a magnification range of 300 to 460X, and can inspect under components with a standoff as low as 0.05mm. An optical tip requires just a 1mm distance between components. Unique to the instrument is the mirrored tip/lens interface, to look under BGA, CSP, LGA and other packages in spite of low standoff heights. The tips are disposable and cost less to replace. An articulating lens rotates 90° (left/right) for easier inspection of interior rows, and features an angle swing of 5° (up/down) for top and bottom connections. With a slight turn of the lens adjustment ring, the operator can move through the underside of the component to check for bridging, cold solder joints, opens, excess flux, contamination and other process-related failures that X-ray cannot easily detect without highly educated interpretation. The system floods the component underside with bright-white light that replicates natural daylight, enhances color rendering and produces sharp, clear and crisp images. Completing the system is a CCD-camera and a LCD monitor. An optional software package includes measurement and process analysis, multi-focusing and image enhancement and a visual defect diagnosis.
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