Thermoset, Lord Chemical Products‘ Gelease MG-200 is a thermally conductive material that combines the very low thermal resistance properties of grease with the integrity of a gel. It has a bulk thermal conductivity of 3.0W/mK and a cure schedule of 3 hours at room temperature. This material has low viscosity (100,000 cps @ 25°C) and high-volume resistivity. Due to its composition, Gelease exhibits excellent flow properties, is easily dispensed through static mixers and is reworkable. It is designed to provide efficient heat transfer from flip chips, PPGAs, BGAs, microBGAs, DSPs, graphic accelerator chips and other high-wattage components. The cross-link structure of this formulation inhibits bleed, separation and pump-out, which is typically associated with many thermal interface materials. It is designed for applica-tions where high-temp cures are not feasible or desirable, for example in optoelectronic or photonic component assembly. A short, oven cure or the operating temperature of the processor itself will allow the material to gel to its final integral state.
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