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Lead-free soldering with free-flow air jet concept

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Lead-free soldering with free-flow air jet concept

Lead-free soldering with free-flow air jet concept
Lead-free solder alloys require melting temperatures about 40K higher than the traditional formulations. However, the thermal specification of most boards and components up to now remained unchanged. Therefore, the upper level of the reflow profile will remain the same as in the past. For example, a process window which today allows a temperature span between cold and hot spot of up to 55K, will reduce to only 15/20K in the future. At this point, conventional forced-convection ovens will reach their limits. Vapour-phase ovens require expensive heat transfer fluids and complicated board handling. Many users doubt that this can be a real alternative. The ever-increasing requirements have led to still higher volume flows, more and more fans as well as bigger and more complicated ovens. Instead of continuously rising volume flows in machines growing bigger and more complicated, the concept of the Smart Reflow oven is moving into exactly the opposite direction. The flow is powered by the smallest and reportedly most reliable driving unit known in the world of fluid dynamics: the free flow jet which uses compressed cold gas to accelerate gas from the environment onto the heaters and the assembly. Along its way to the board surface, the jet is heated up and slowed down. It reaches the surface with almost the same temperature as in the oven environment and with a well-defined speed (important to prevent misalignment effects). At this point the jet is still highly turbulent, which provides an extremely high heat transfer coefficient.The patented jet drive works more efficiently than all known convection processes. It provides minimal DT even on extremely complicated boards. The whole process chamber does not contain any moving parts. No wear of drivers or sealing components, this means high reliability over a long lifecycle. The process chamber is free of any electrical components and wiring. This too guarantees high reliability, low maintenance costs and perfect EMC. The continuous process gas purifying action keeps muffle and installations clean. The compact design of the inner casing with only two sealings provides perfect tightness, reportedly evenafter many years. The process chamber is only approx. 250mm high, equipped with upper and lower heating zones. This compact geometry guarantees good heat insulation. The low thermal mass provides fast start up times of between 10 and 15 minutes. The ready-to-use concept requires electrical mains supply only. No cooling and no waste air exhaust are necessary.

Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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