The Heraeus lead-free, no-clean solder paste F 610 Cu 0.5 reportedly shows an outstanding wetting capability, and can be soldered both in air and nitrogen, preferably on NiAu surfaces. In addition, on Cu OSP and chemical Sn surfaces, good wetting results can be achieved. Further properties are: very high green strength, the first print after a pause is complete, very high SIR (surface insulation resistance), and excellent printing properties (resolution). In-circuit tests can be performed without previous removing of the flux residues since only low amounts remain The needles penetrate flux residues easily. The paste rheology is optimized to allow excellent printing performance with narrow openings. The high green strength allows the application before high-speed placers. The flux passes the generally applied SIR tests also under the harsh conditions of the automotive industry: 85°C/85%rh, 21 days, measurement with 100VDC.
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