The introduction of a special LPKF plastic material allows for the first time the production of 3D injection-molded circuit carriers as reflow-capable MIDs (molded interconnect devices) using laser-direct structuring. MID technology can now be integrated into the standard SMT process, and this opens the way to a broader application. The high-temperature resistance (melting at 295°C), together with the straightforward processing (due to polyamide base polymer), combine in these plastic material. A laser beam depositions metal nuclei to start the process, and to activate the surface areas that require metallization. Then follows a wet-chemical metal-lization process (copper immersion bath without external power) for the generation of high-adhesion conductor tracks. A defined roughness is also provided on the surface, using fill material to create the adhesion surface for the metal coating layer in the immersion bath. This process of LPKF allows straightforward production of conductor track widths and separations of around 100µm directly on plastics of all designs that can be then reflowed without troubles.
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