Kulicke & Soffa is introduc-ing the WaferPRO, a large-area stud bumper that offers 300mm capability, combining single-pass processing with the high cycle speed of up to 16 bumps/second at 60-micron in-line pad pitch. The large 400 x 330mm (16 x 13-in) bond area enables single-pass bumping/coining of 75 to 300mm wafers with ±5µm accuracy at 3-sigma. A variety from manual to fully automatic wafer handling is avail-able. A key to the high productivity is a lightweight bondhead mounted on a rigidoverhead structure for maximum accuracy and stability. Programmable camera focus allows pattern recognition over a wide range of wafer heights. The vision system features confirmed 0.1 pixel accuracy for maximum units per hour and high meantime between assists. A 120kHz transdu-cer enables low-temperature bonding of thermally sensitive substrates.
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