The newly revised, jointly developed standard IPC/JEDEC J-STD-020B, Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices, identifies the classification level of SMDs that are sensitive to moisture-induced stress. It determines what classification level should be used for initial reliability qualification. Once identified, SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during solder reflow and repair operations. This revision covers components to be processed at higher temperatures for lead-free assembly. The J-STD-033A, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, provides SMD manufacturers and users with methods for handling, packing, shipping and application of moisture/reflow sensitive SMDs. Now updated to support components that may need to be processed at higher temperatures, such as lead-free processes, these methods help avoid damage from moisture absorption and exposure to reflow temperatures that can result in yield and reliability degradation. It helps achieve safe and damage-free reflow with the dry pack-ing process and provides a mini-mum shelf life of 12 months from the seal date when using sealed dry bags.
Share: