IPC and JEDEC (the Solid State Technology Association) have plans for preparing electronics manufacturers for the inevitable European ban on lead and other toxic substances by co-sponsoring conferences in Europe and Asia in 2004 as well. Reportedly, IPC and JEDEC have taken an active role in keeping the industry informed of changing requirements and encouraging the voluntary elimination of those substances. The organizations will host conferences in August 2004 in Singapore and on October 20 to 22 in Frankfurt/Germany. Each conference provides tutorials focusing on such subjects as manufacturing with lead free, halogen free and conductive adhesive materials, as well as various workshops that introduce lead-free solders and present selection criteria. “With just over two years to go until the European deadline, no topic is hotter in the global electronics industry than lead-free technology,” said David Bergman, IPC’s VP of standards, technology and international relations. IPC and JEDEC also select industry experts to present a two-day technical conference covering lead free topics. Presently, conference chairs Jean Hebeisen and David Bergman of IPC and John Kelly and Donna McEntire of JEDEC are seeking papers and presentations pertaining to the following areas: policy – European lead ban status; EMS industry – on the front line of the change; component issues (passives and actives); design issues; environmental health and safety effects and alternatives; PCB issues; OEM/consumer demands/voluntary elimination dates; recycling options; substitution – new commercially available alloys/conductive adhesives/ease of replacement, cost issues; reliability evaluations (temperature cycling data, tin whiskers); roadblocks to implementation; finishes issues – organic solder protectants, immersion tin, silver, electroless nickel, palladium, etc. The deadlines for abstract submissions are as follows: Singapore May 28; Frankfurt July 30, 2004.
EPP EUROPE 404
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