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Indium Corporation announces new jetting solder paste

Second material to come out of partnership with Mycronic
Indium Corporation announces new jetting solder paste

Source: Indium Corporation

Materials refiner and supplier Indium Corporation has announced a new jetting solder paste in its line of PicoShot products. PicoShot WS-5M is designed for customers needing an SnPb solder paste for their Mycronic MY-series jet printers.

The new product is a water-soluble, halogen-free paste developed as a result of a close, collaborative relationship with Mycronic for their MY 600/700 jetting systems. This product has been beta-tested at customer sites, showing proven performance on customer lines.

It has been extensively tested to provide exceptional jetting performance, delivering: 

  • Smallest dot volume among pastes in its class: 6.5nl/dot, 350µm diameter
  • Precision deposit (x,y targeting)
  • Long usage (syringe life) >8 hours
  • Minimal statellites

The solder paste is water-soluble and halogen-free approved after joint Indium/Mycronic technical development with Mycronic’s MY 600/700 jetting systems. The PicoShot line can be used in applications, such as jetting into cavities and uneven/warped substrates, high-mix/low-volume stencil replacement, CSP/microBGA solder attach, military and aerospace jetting applications, system-in-package (SiP), camera module assembly where an overmolding step is required, and shield-attach and secondary processing.

Utilizing a Type 5 solder powder and an SnPb alloy, this material is inherently chemically compatible with Indium Corporation’s Indium6.6HF-HD Solder Paste. PicoShot® WS-5M’s unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

www.indium.com 

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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2022
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