High-accuracy and stress-free stepped-lids, essential for sealing semiconductor and hybrid packages, are now available from Tecan in a single source, cutting out the time and quality problems associated with contracting various specialists. Electro-plating for example is a function often contracted out by lid makers. Tecan can produce lids with no manufacturing tags or witness marks, assuring the uniformity necessary for accurate bonding to the recipient hybrid tub. Highly accurate photo-chemical techniques are used to manufacture the parts, and tooling costs are low. The process also brings benefits at no extra cost – part numbers, company contact details and other data can be etched onto the lid. Typical materials include nickel alloys such as Kovar, Dilver P and Olin 194. Others are available. The electroplating en-compasses all expected finishes – from electroless nickel, to hard-acid gold and pure-soft gold.
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