LPKF has introduced a system for cutting wafer print stencils which operates with a speed of up to 50,000 cutouts per hour. The very small apertures can be provided in any shape, and with a minimum radius of only 10 micrometers. This reportedly has created a breakthrough in the use of laser technology in cutting wafer stencils. The key lies in the combination of a special laser source with an optical next-generation system that cuts small apertures extremely fast and in any shape without moving the XY table. Economical use of laser technology was previously compromised by throughput when cutting non-round shapes. Wafer print stencils feature an enormous number of apertures in an extremely fine pitch, and these geometries are very demanding on the precision and throughput of the production process. LPKF’s TurboCut technology overcomes these challenges and allows stencil cutting with high quality and uniform material thickness.
EPP EUROPE 436
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