The Alphasem EasyLine 8001 performs high-speed die sorting into multiple waffle packs/trays, and features a 30% smaller footprint than comparable machines. Process control, down to the smallest die size, is realized by a handling system with closed-loop controlled linear motor, based on air-bearing technology. This mechanism guarantees consistent placement accuracy at high speed. The platform also handles epoxy die-attach applications onto metal leadframes. Another benefit is the powerful vision system that efficiently supports setup activities and product changeovers. An important engineering aim was low-cost of ownership in IC packaging.
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