StratEdge has received patent No. 6,271,579 for its high-frequency passband package. This low-cost family of DC to 23GHz ceramic packages provides an interconnect system for high electrical integrity, mechanical protection and thermal control in harsh environments for GaAs devices. The packages feature two or more RF and multiple DC leads, providing easy attachment to the next level of the system while still maintaining the integrity and electrical performance of the integrated circuit. The package combines a copper composite base with a microstrip-imbedded, microstrip-microstrip transition design. This composite metal base provides thermal conductivity and expansion compatible with gallium arsenide chips. A plastic cap lid with epoxy preform finishes the structure and provides protection for the device.
Share:
