A family of novel dielectric and optical materials, which can be highly planarized and cured below 170°C, will enable volume fabrication of electronic, optical and opto-electronic devices at low cost and high productivity. The still ongoing work is part of a European-based, 15-partner cooperation (Dondoderm) under the Brite-Euram research program. Among the industrial partners involved are CSEM (Switzerland), Thales Airborne Systems (France), Suess MicroTec, Heraeus and Micro Resist Technologies (all of Germany). Project leader is the German Fraunhofer ISC, which has trademarked the new material Orcomer.
The Orcomer hybrid polymer promises a photo-patternable (per lithography) material that consists of a silica-like network at the molecular level. It can be modified to specific applications by various precursor (alkosilanes) formulations. This spring, several spin-off firms of CSEM are to produce the first 2 x 2 monitor modules for VCSELs and fiber couplers. Suess is reported to have developed a special mask aligner for Orcomer materials. Another follow-up industrial cooperative including Bosch, Motorola, Thomson Detexis and Ericsson is developing Orcomer FR applications. Bosch has demonstrated a 3D-stacked patch antenna and a coplanar microstrip line transition. Ericsson, in conjunction with Swedish research institute ACREO, has shown a microprocessor MCM L/D design (BGA and bare die) on BT as well as on FR-4. Additionally, both companies have developed a 19 x 19mm transmitter MCM L/D with driver-chip array, VCSEL array and waveguide connector on SBU board with integrated waveguide in three dielectric layers of Orcomer. (ws)
Share: