The Profile series of forced-convection reflow ovens complies with Conceptronic’s dynamic flow engineering principle which integrates heating, cooling and flux management and so ensures solder joint integrity as well as cost-effective performance in high-density, high-mix applications. Flux is removed with-out filters in both the heating and the cooling sections of the oven.Gas flow is serpentine-shaped with forced impingement convection. The oven employs an exclusive multi-port blower design. Underside board support is provided as an option with low-mass cable for single and dual-lane versions. The cooling modules are either ambient air or gas-to-gas heat exchangers. Optional circulation extends the maintenance cycles of the cooling section. The Profile runs on Windows NT with closed-loop process-control software.
Share: