The new ProtoLaser U from the german laser specialist LPKF Laser & Electronics AG, breaks new ground in the UV laser machining of different materials. Although it looks very similar on the outside to its twin, the LPKF ProtoLaser S, the hood hides a different laser source with special features of its own: with its UV laser system, the ProtoLaser U can cut, drill and structure almost any kind of material. “Whilst the ProtoLaser S and its infrared laser is perfect for the structuring of printed circuit boards, the ProtoLaser U’s forte is micromachining,” explains LPKF Director Bernd Lange. And the attractive system price opens up UV laser technology to a bigger circle of users. For instance, the ProtoLaser U can depanel individual PCBs from a large printed circuit board in a stress-free and precise process. It can also cut LTCC and prepregs, drill holes and microvias, structure TCO/ITO layers, and open up solder masks. The high pulse energy of the UV laser causes ablation without leaving behind any residues. The result: contours with very accurate geometries. The integrated vacuum table holds flexible and thin substrates safely and firmly in place. The laser process is controlled by the integrated CircuitCAM software.
EPP Europe 507
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