At Apex Hesse & Knipps presented its Flipjet FJ520 which offers great advantages in applications that require high functionality on smallest space. With a footprint of 950 x 1,550 mm the machine provides a working area of 200 x 250 mm (bond axes) and a 15 mm z-hub. It can be used for 4“ to 8“ wafers. Optional the machine can be fitted to process 12“ wafers. Three cameras are used for pattern recognition: The wafer camera is fixed over die-ejector postion; second camerais at hand-over position and third camera at bond head. Each camera has two programmable light sources. The application-oriented Hesse & Knipps image processing module allows standard and alternative pattern recognition. Two bonding heads are available, one with a bonding power of 4 W and a bondforce of20 N , the other with a bonding power of 50 W and a bondforce of 150 N. The control system includes motion control, sensor control (incl. PRS) and the ultrasonic generator. Hesse & Knipps, based in Paderborn (head quarters), San Jose and Hong Kong, has long-term experience in ultrasonic technology, what promises optimal solutions for bonding processes.
EPP Europe 428
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