Tresky’s flip-chip option for its T3000 die bonder and component placer units contains a beam splitter that enables a simultaneous view of the substrate and the chip bump patterns. With the zoom lens, the field of view can be varied from 1 x 1 to 4.6 x 4.6mm or from 2 x 2.6 to 12.7 x 16.7mm, respectively. The optical unit, which is inserted between component and substrate, and contains a high-reso-lution color camera, shows the topside of the substrate and the bottom side of the chip on a monitor simultaneously. Further options are a fiber-optical illumination of the flip chip for high magnification, heating of the pick-and-place tool (to 450°C), and heating of the stage with integrated hold-down and hot gas. With an optional flux station, a constant layer of flux or adhesives can be provided. The silver glass option achieves a pre-defined glue thickness.
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