The CuPRAplus from Kulicke & Soffa Industries supports highly consistent and stable fine wire 2nd bonds, while maintaining the quality of the overall wire bonding process. By ensuring both 1st and 2nd bond quality during fine copper wire bonding, the copper capillary offers a more stable mass production process and works together with the firm’s iCu Copper wire and bonder kit to provide a complete solution for manufacturers looking to take advantage of the cost advantages offered by copper wire. The product can handle copper wire from 0.8 mil to 3.0 thicknesses.
SMT, hall 7-314/Nepcon UK, G72
EPP EUROPE 469
Share: