F&K Delvotec’s single-station large-area die bonder 4501 offersa region of 640 x 150mm for epoxy bonding together with an eutectic capability. Eutectic die-bonding is of special interest for high-frequency and high-power applications. The machine offers the ability to handle chips with soldering layer as well as preforms. Programmable temperature, time and ramp profiles are executed during the soldering process. A preheated forming gas atmosphere prevents oxidation of materials during the process, and also purifies sub-strates and dies before soldering. The placement accuracy is specified as ±12µm/3-sigma. The requirements for eutectic die bonding are simply that dies and substrates aretemperature-resistant. The advantage over epoxy die-bonding is an even and very thin metallic layer of solder between die and substrate. This results in excellent heat and eletric con-ducting properties as well as a solid mechanical bond. The machine is capable of multi-chip bonding, and allows changing applications from epoxy to eutectic die-bonding without additional operator training.
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