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Dispensing of packages and boards

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Dispensing of packages and boards

Dispensing of packages and boards
Asymtek introduces the Axiom X- 1020, a mid-range in-line dispensing system for semiconductor package and board assembly. The platform incorporates numerous features that allow to achieve a level of performance and accuracy not previously available, and is ideal for applications such as flip chip and CSP underfill, dam&fill, solder paste, thermal compounds and more. A processor mounted directly on the head controls the valve, needle heater, height sensor, lighting, etc. A second controller manages all of the conveyor-related functions including the width and belt motors, substrate heaters, conveyor and pneumatic, as well as the SMEMA interface. The main controller hosts the operating system and application software. A bus architecture enabled dynamic dispensing control of the head through closed-loop servo technology. The actual position of the dispense pump motor can be controlled with high precision for accurate dispensing of dots and lines.In addition, linear encoders mounted on the cable drive for the X and Y-axes give much greater flexibility. A calibration module condenses the tactile needle sensor, vacuum purge station and mass-flow sensor into a compact unit, resulting in maximum efficiency and minimal wasted motion. The vision system has a field of view of 12.5mm, and uses a lighting system with both red and blue LEDs that can be independently set for 255 light levels. The height sensor allows a second valve to be positioned closer to the camera and valve.

Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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