A combination of accuracy, speed and versatility makes the Assembleon D-9 platform for a wide range of semicon applications including stacked die, multi-chip modules, multi-chip and flip-chip in packages, flip-chip on foil, flip-chip on board, etc. Based on modular design, this equipment provides placement throughput of 2700 flipped chips/hour with 9µm accuracy/3-sigma. The machine accommodates up to 75 different components simultaneously, with dimensions ranging from 0.3 to 44mm square, and with a vision system which can recognize ball sizes down to 70µm. Closed-loop Z-axis provides placement forces from 0.9 to 40N (fixed 0.06N), ideal for fragile products. It accepts numerous feeder options, and supports a wide variety of substrates, leadframes, carriers and so on. A flux dipping unit, depositing layers from 20 to 120µm, is an option, as well as wafer feeder handling sizes from 100 to 300mm, and die sizes from 0.5 to 25mm square. It accommodates automated change and expansion of wafers, and further options such as a flipping unit, barcode reader and wafer mapping. The machine complies with cleanroom class 1000 and SEMI S2/S8 requirements, and with the SECS/GEM interface.
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