High-speed, portable direct-die feeding is the hallmark of the DDf device – the world’s first according to its maker Hover Davis. The die feeder caters to the cost-effective, package-less handling of wafer-level SMDs – thereby getting rid of trays and embossed tapes. The feeder contains a control panel which is easily accessible to the operator. It offers a Windows-based interface for quick programming and troubleshooting. Dies are extracted from the vertically positioned wafer and are conveyor-transported to the pick point. There is a choice of connecting to the host via RS 232, ethernet or through a factory connection scheme. The direct die feeder is only 80mm wide. Useful accessories for comprehensive application solutions are available.
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