It is still a challenge to reduce the amount of production process steps in microelectronic production, for saving time and resources and ensure process reliability. Combining technologies in one unit is one way to reduce process steps. We present you an interactive system from UniTemp, which combines the full range of plasma applications with the full spectrum of thermic processing engineering (see page 44). Package on package (PoP) technology allows board designers to increase utilization of PCB real estate, to achieve greater functional density or memory density in successive generations of products. Stacked components create new challenges for rework, especially in the removal process as it is recommended to reflow solder these assemblies just once and remove the stack in a single heat cycle. Paul Wood from OK International gives a review how to rework lead-free PoP assemblies (see page 34).
As the speeds and outputs increase, so does the heat generated. Although automotive electronics engineers have been successful using thermal pads or cushions in the past, as devices get smaller yet experience higher speeds and outputs, the industry must employ thermal greases, adhesives and gels to meet the increased requirements for heat dissipation. Further adding to the mix of solution from which members of the automotive industry can choose is advanced laminate technology. George Sears of LORD Corporation describes solutions to provide the necessary thermal dissipation (see page 22).
Combining AOI and AXI into a single AOXI system sharply reduces investment and saves valuable factory floor space. In our cover story we will take a closer look at such a system that makes it possible to inspect and evaluate all defects, whether visible or hidden, in one run, providing high inspection depth and maximum throughput. No matter how complex the layout, this solution from Viscom is in the position to inspect all solder joints, positively and reliably (see page 18).
Best wishes,
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