This year’s Productronica opens its doors to the electronics-manufacturing community from November 13th to 16th in the Bavarian capital of Munich where it has taken place every two years since 1975. A total of 1,500 companies and 44,000 visitors are expected at the trade fair. Exhibitors will present the complete range of electronic production in the halls of the New Munich Trade Fair Centre. The amount of exhibition space has increased substantially. Both the areas of foreign and German exhibitors are larger than at the previous event. This trend could already be felt with companies coming from outside of Germany over the past years while the area for German companies has increased for the first time in years. The trend topic microproduction with micro- and nanotechnology occupies the complete area of Hall B5 at Productronica 2007. The focal points are bonding and packaging, among others. We have five technical articles dealing with these themes in this issue.
We also take a closer look at a multidimensional control system for bond quality (see page 70), and show a new technology for producing OLED masks, the so-called water jet-guided laser cutting (see page 62). In our cover story we focus on a new high-end placement machine which sets a new record in terms of practical placement speed by placing more than 100,000 components per hour in real-life applications (see page 24).
What else is new? To mention only a few items: we present you an entirely new stencil printer which is not based on the technology of preceeding models. It is geared toward manufacturing environments demanding a high degree of flexibility and accuracy (see page 30). Flexibility and precision are also important characteristics in the world of soldering. A new product line includes not only new reflow and selective soldering systems, but also a corresponding machine for wave soldering applications (see page 42). In our test and quality section we describe an easy-to-use desktop AOI system that is able to reliably recognize all essential defect features (see page 72).
Best wishes,
Share:
