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Creep and stress of lead-free solder

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Creep and stress of lead-free solder

Creep and stress of lead-free solder
A new technique has been evaluated for creep and stress relaxation measurements of lead-free alloys. Current materials data comes from measurements on bulk samples, with millimeter-sized cross-sections, which is not representative of typical solder-joint volumes on assemblies today. The British NPL has addressed these requirements for generating creep data and tested a sample design, in which stress is applied in shear direction. The specimens can be prepared with minimum demand on workshop facilities and with a high level of precision. Volume of solder joint can be made as small as 1.6 mm3, which is comparable in size to a BGA solder bump. Only two materials are required to form a test piece, copper and the solder. If a specific combination of PCB finish and solder alloy are required to be evaluated, the finish can be applied before formation of the solder joint. Important materials creep data are shown in the figure, and were obtained by electro-thermal-mechanical testing. These results show a clear difference between conventional tin-lead and lead-free alloys. The technique can also be used to measure relaxation rates.

EPP EUROPE 404
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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