From March 20 to 21, 2002, at the Congress Center in 71032 Böblingen/Germany (near Stuttgart), the Flip Chip & Chip Scale Europe 2002 will be taking place. An abundance of technology-based papers presented from experts from all over the world will await the attendees. Just a few highlighted headlines for this: packaging forecast; HDI boards; manufacture, technology, design and application of flip chips, CSPs and other advanced components such as wafer-level packages; quality assurance (test and inspection); bonding technology, nano technology and many more. Reportedly, for European attendees this event is a good opportunity to quench their thirst for information on these highly topical questions. Conference language is English.
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