The public benchmark test of stencil printers will take place from June 3rd to 5th, 2008, at the SMT/Hybrid/Packaging trade show in Nuremberg, Germany. It provides an ideal opportunity for a realistic and real-time comparison of machines from different producers.
Stencil printing is still the most common process to apply solder paste on printed circuit boards. However, the fine-pitch method makes high demands on application of solder paste with a stencil printer. In case of an upcoming investment or just for general information only a few users have the opportunity to realise realistic and real-time comparative tests with machines from different suppliers. In order to meet the need for a feasible comparison, the trade journals EPP and EPP Europe (Konradin Media) supported by Mesago Messe Frankfurt (the organiser of the SMT/Hybrid/Packaging show) present and organise the EPP Benchmark Arena for stencil printers. The benchmark test focuses on mid-range, in-line equipment.
On the part of the printers the well-known manufacturers DEK (Horizon 01i), EKRA (X6 HSI), Essemtec (SP900-USC-V) and ANS answer elektronik (Speedprint SP210avi) take part in the public benchmark test. All these machines are forming a line, linked by automation modules of Asys. The benchmark test is further supported by renowned companies such as Zestron (cleaning agents), Christian Koenen GmbH (stencils), W. C. Heraeus GmbH’s Contact Materials Devision (solder paste, test board), Systronic (cleaning unit), Vliesstoff Kasper GmbH (accessories/tissues) as well as PB-Technik (AOI-System Aspire for solder paste inspection; by Koh Young).
The test will take place during the 3-day SMT exhibition from June 3rd to 5th, 2008, in hall 7, booth 639. There will be five print runs each day, starting at 10:30 am. The PCBs to be printed on are the specially designed Benchmarker II by Heraeus.
Between the print cycles visitors have the opportunity to speak to technicians of the present suppliers. The results of the benchmark test will be presented at the show and in detail after the show in the corresponding issues of EPP and EPP Europe.
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