Advanced Interconnections has introduced another series of its BGA socket line. The Flip-Top dramatically reduces board assembly space for BGA and LGA device socketing in development, test and production applications. The compact design offers exclusive eutectic solder ball termin-als and patented BGA sockets. It is available in virtually any 1.27mm (.05-inch) pitch footprint and features gold plated terminals and contacts with an integral, finned heatsink or coin screw retention clamp. The socket is only 3mm wider and 10mm longer than the BGA, has a height without heat sink of .67-in (17mm) from board and conforms to industry standard coplanarity.
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