The International Microelectronics and Packaging Society (IMAPS) will hold its Nordic Conference 2002 at the Globe Hotel, Stockholm, Sweden, September 29 through October 2. It is the 39th recurrence of this annual technology event that draws hundreds of the engineers, management professionals, technicians, purchasers, suppliers and marketers from Scandinavia and beyond. Topics covered in the conference include microelectronic applications; trends in telecom; ceramics for electronics; encapsulation and underfills; microvia, HDI laminates; CSP, flip chip and other area-array packages; bare die, MCM and 3D-packaging; strategies and R&D; advanced interconnect; integrated passives and systems-in-package (SiP); cost assessment; Pb and halogen-free electronics; MEMS and much more.
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