The Alpha OM-310A lead-free, no-clean solder paste by Cookson Electronics enables assemblers to comply with environmental regulations for lead-free processing, while requiring only minimal oven modifications. It fits easily into the existing range of processes, and prints to fine-pitch tolerances with high definition and contour stability. With speeds of up to 150mm/s, and a wide lead-free reflow process window with good solderability on different board/component finishes, the paste gives high throughput opportunities and good quality joints. After reflow, the no-clean formulation leaves minimal clear flux residues which are pin testable, and give excellent lead-free cosmetics previously thought unobtainable with Pb-free alloys. Mid-chip solder balling of none-to-minimum occurrence was observed for 1210, 0805, 0603 and 0402s (lab tests). The paste is available in SnAgCu (SAC) and SnAgBiCu alloys, packaged in pots, cassettes and cartridges. Reflow in either air or nitrogen is possible, with printing using laser cut or electroformed stencils and metal squeegees for best results (stencil life >8h).
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