Ultra-small footprint, rigid solder joint and repeatable pin-to-pad alignment are the key features of the TreadHead and MiniFoot SMT pins from Autosplice. A novel design features special tread patterns on the bottom surface of the TreadHead pin. This promotes rapid outgassing during reflow, which creates a vacuum under the head and pulls the pin tightly into alignment. The MiniFoot pin is bowtie shaped to provide a stable founda-tion and secure solder wicking for a solder fillet around the base. It is available in various lengths and it is compatible with the AutoFeeder equipment. Copper construction pro-vides high conductivity (101% IACS at 20°C). Solderability conforms to IPC J-STD-002A. MiniFoot is packaged on a reel; ThredHead comes on tape or reel.
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