Communication technology requires cost-effective and reliable optoelectronic components, but 60 to 80% of the production costs are placed by assembly and packaging. These costs can be significantly reduced with automation. An optical transmitter, for example, consists of a combination of elements that cannot easily assembled by conventional automation equipment. Datacon uses its modular 2200 apm system platform, which is characterized by high flexibility and precision as well as a small footprint. All different parts and submodules – some non-electrical – must be positioned with the highest precision, assembled and tested. Many of these are particularly sensitive, e.g. InP or GaAs dies, or very small (below 200µm) and must therefore be handled with high care. A procedure used here is the rapid curing of epoxies by ultraviolet light. Some optoelectronic parts can be magnetic and attract other metal parts during assembly, thus changing their relative placement. To prevent this, they are reliably fixed in place before rapid UV curing of the glue. The company has resolved the issue of a lack of UV transparency of adhesive.
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