The Topcon’s Vi-series high-res wafer inspection systems (European rep Macrotron Process Technologies) provide defect detection and inner IC dimension measurement of wafer sizes of up to 200mm, framed wafers and chips in tray. The systems are designed for final IC-inspection, MEMS and discrete applications. Particles, chippings, pads, ink dots, film defects, etc. can be detected down to 0.5µm. An auto-alignment mechanism adapts to each displaced chip after wafer sawing/expansion. With a high-focus depth lens, the viewing area will be adapted to the die size and keeping the adjusted sensitivity at optimum throughput. Even the highest brightness/contrast range won’t negatively influence the detection sensitivity. The inspection parameters are individually adjustable for many areas within one field of view. In combination with an optimized algorithm, resolution with one quarter of a pixel is provided, so complicated inspections are accomplished at a reportedly very high recognition rate and repeatability of >98%. Import and export of defect maps to probers and handling systems, off-line programming, review and inking function are offered optionally. Defect and system data are transferred in SECS/GEM format.
www. macrotron-pt-com
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