The end of 2004 has marked a significant milestone in the anticipated progress towards implementation of lead-free soldering technology. According to the EU Lead-free Soldering Technology Roadmap published by Soldertec Global, assembly companies hoping to match average market progress should have at least half of their products lead-free by the end of 2004, whereas large manufacturers are expected to have achieved almost fully lead-free production.
Kay Nimmo of Soldertec Global commented, “Everyone should now be aware that the final deadline for the replacement of lead, and other hazardous materials, in electronic products according to the RoHS Directive is July 2006. However, it is important for people to realize that in order to plan for that final deadline, both suppliers and assemblers need to be well on the way towards lead-free production now. One of the main aims of the lead-free roadmap was to give a clear indication of a timescale for the transition away from the use of lead, allowing electronic manufacturers to compare their performance with others”.
Suppliers and assemblers should also be considering all the other actions that need to be put in place in order to be able to demonstrate that they have taken the required steps to comply with the national legislation. For example, steps should be taken for the following:
- Materials declaration system with suppliers
- Records keeping for 4 or more years
- Analysis of materials supplied to check for compliance with the RoHS limits on banned substances
- Standard materials marking systems such as promoted by JEDEC
Industry data collected by a survey of the EU electronics industry was used to compile the lead-free roadmap. Soldertec Global is reportedly the only membership-based organization in Europe which has established regional guidance recommending timescales for components manufacturers and electronic assemblers to develop products that will comply with imminent European legislation. It is part of the materials division of Tin Technology, a company supported by major tin producing and consuming industries. The organization offers a range of services: reliability testing for requalification of lead-free assemblies, failure analysis, X-ray inspection, RoHS analysis, mechanical testing and solderability assessment. The European Lead-free Network (ELFNET) co-ordinated by Soldertec Global is currently carrying out an industry survey to gauge the level of progress towards lead-free in each individual country. (gbw)
EPP EUROPE 404
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