Alpha-Fry/Cookson Electronics‘ tape & reel packaged solder preforms allow precise amounts of solder to be deposited selectively and without special equipment. Reduced solder deposits on boards often have to be supplemented when larger components are to be attached. But trying to add extra solder creates its own problems, because to print larger pads means a risk of bridging, and stepped stencils and rubber squeegees may bring quality issues (paste scooping and bleed), and with more flux in the increased paste deposit there’s the risk of solder balling. To apply components after reflow involves accurate hand soldering or an additional dispense operation and secondary reflow process. With Exactalloy preforms, solder is deposited in the right place and in the right volume using standard pick & place equipment, and then reflowed normally. Working with equipment manufacturers, Alpha-Fry developed a range of preforms which are tape packaged and applied in the same way as standard SMDs. The preforms are available in a choice of alloys (including lead-free), shape and size to suit each application.
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