Despite the global economic crisis the exhibitors are focusing on SMT/Hybrid/Packaging mainly for two reasons: To enhance brand awareness in the market and to take advantage of new opportunities.The exhibition will provide a comprehensive overview of the sector from design and development, PCB production, component parts, placement technologies, testing equipment and the latest processes. A top-class congress and tutorial program complement the show.
The exhibition provides numerous highlights: “Innovations in PCB technology – basis for complex electronic systems” is the motto of the VDI/VDE group stand (Booth 6–220).
Under the conceptual auspices of the „Fraunhofer IZM“, at „Optics meet Electronics“ electro-optical packages, modules and assemblies, optical interfaces and materials, optical and automotive communication, optical sensor technology and systems are on display. (Booth 6–424).
The ZVEI EMS group stand “Service Point EMS” provides the chance to directly compare many EMS suppliers (Booth 9–512).
The Exhibition Forums will offer a 3-day comprehensive programme with numerous companies presenting and discussing topics:like „Green Devices: Status quo on regulatory requirements”, QFN/LGA Assembly, Reliability and Process Yield Improvements, Manufacturing logistics.
Conference and Tutorials
The conference with tutorials, taking place concurrently with the exhibition, is the most important application-oriented meeting point of the micro electronics industry in Europe. The conference is providing insight into latest research results, solutions and user experience and gives the opportunity for attendees to discuss.
The conference day on 6 May 2009 (held in German) will deal with “Manufacturing of printed circuit boards based on flex and rigid-flex substrates”. , Two sessions will highlight the latest results on both materials and substrates and on assembly technologies and manufacturing.
In addition, 21 half-day tutorials will be provided on 5 and 7 May 2009, which will offer first-hand information in German and English. The tutorials will deal with topics such as system integration, system in package, solder joint quality, lead-free, manufacturing control, wire bonding for power electronics, multi-functionality and the use of standards. Developers, manufacturers, suppliers and users will be provided with answers to their day-to-day questions.
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