The Metcal APR-5000 array-package board-rework station offers repeatability, accuracy and thermal control essential for safe and effective work on boards populated with BGA, CSP, land-grid array (LGA), microSMD, micro-leadframe (MLF) and bumped-chip packages. Capable of handling boards up to 8 x 10-in with a placement accuracy down to 25 micron and interconnection pitches as low as 0.3mm, the system is ideal for reworking smaller boards. With such assemblies characterized by small, odd shaped boards and advanced packages, the station delivers highend performance required by these products at a competitive cost. It incorporates an vision system, allowing operators to simultaneously view the board topside and an image of the underside of the component. With micrometer adjustment, images can be aligned in the X, Y and Theta axes prior to placement. The rework system uses low airflow forced convection heating, to deliver temperature uniformity. Closed-loop, computer-controlled parameters of time, temperature and airflow assure process repeatability and precision. User-friendly software controls the four stages of the reflow profile: preheat, soak, reflow and cooling. Board temperature can be monitored, and real-time adjustments can be made to all parameters while the profile is running.
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