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Archive für September 2022

Archive - September 2022

Wafer-level system integration
New Site Director at Fraunhofer IZM-ASSID

Two years ago, our Institute’s site in Moritzburg – the »All Silicon System Integration Dresden – ASSID« - was able to celebrate a decade of successful...

Vapour phase soldering solutions
Altus offers energy-saving soldering solutions

The rising cost of energy is putting a strain on everyone, including those within the electronics industry. As wholesale gas and electricity prices continue to...

Integrated robotic solutions
Orbit One builds robot manufacturing cell

Swedish contract manufacturer of electronics and electromechanics, Orbit One, has announced that it has built a new robot cell at its plant in Ronneby, Sweden...

ESTC 2022
ESTC22 in Sibiu ended up very successful

The 9th Conference on Technology for the Integration of Electronic Systems (ESTC 2022) was held in Sibiu from 13-16th September 2022.

ESTC is one of three...

Inspection of hidden solder joints with Nordson Test & Inspection
Making the invisible visible

Manufacturer of equipment used in the testing and inspection of electronic components, Nordson Test & Inspection, says its Quadra series manual x-ray...

EV Group
Nanocleave layer release technology

EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced NanoCleave, a...

Adhesives manufacturer strengthens position in Thermal Interface Material (TIM) market
Henkel acquires Thermexit business from Nanoramic

Leading adhesive technologies provider Henkel has acquired the Thermal Management Materials business of Nanoramic Laboratories (Nanoramic) headquartered in...

Adhesives manufacturer strengthens position in Thermal Interface Material (TIM) market
Henkel acquires Thermexit business from Nanoramic

Leading adhesive technologies provider Henkel has announced the acquisition of the Thermal Management Materials business of Nanoramic Laboratories (Nanoramic)...

Increased test efficiency for automotive radar test chamber
Rohde & Schwarz expands antenna test system features

Global provider of test and measurement software, instruments and systems Rohde & Schwarz has augmented its R&S ATS1500C antenna test system with a new...

Yole
Strong momentum pushed by the giants

The top 8 advanced packaging players dominate the market and continue with heavy investment.

• The advanced packaging industry is expected to have a 9.6%...

PCB maker acquires Danish PCB solutions provider
Icape Group acquires Møn Print

Global technology distributor of printed circuit boards, Icape Group, has announced that it is has acquired Møn Print, a major supplier of PCB solutions in...

Palomar Technologies
New Managing Director

Palomar Technologies, a global supplier of total process solutions for advanced photonics and microelectronic device packaging, has appointed Mr. Thorsten...

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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2022
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