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Archive für August 2022

Archive - August 2022

BGA rework systems
PDR debuts new integrated reball system

Manufacturer of BGA rework systems, test and X-ray inspection systems, PDR Rework Systems, has released a new integrated reballing system for all PDR Evolution...

Adhesive solutions for semiconductor packaging, electronic components and device assembly
Henkel Korea opens Songdo plant

Henkel Korea has announced the completion of its state-of-the-art Songdo Plant within the Songdo High-tech Industrial Cluster in Incheon, which will become the...

Pressure-temperature sensor technology
ViscoTec debuts miniature flush pressure sensor

ViscoTec has announced the launch of the world’s smallest flush pressure sensor with a chemical – largely inert – pressure membrane made of FFKM. The...

Semiconductor Packaging
90 presentations on semiconductor packaging

The 9th ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC 2022) will take place in-person in Sibiu (Hermannstadt), Romania, in less than a month. ESTC...

Selective soldering systems
Sasinno debuts fully automatic screen printer

Provider of selective soldering and turkey THT line solutions Sasinno has announced the introduction of its new H Series fully automatic screen printer. By...

No flow / low flow prepreg for high reliability applications
Ventec expands flex-rigid material range

Producer of epoxy laminates and prepregs and provider of thermal management and IMS solutions Ventec International Group has added a next-generation no &...

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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2022
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