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Archive für September 2010

Archive - September 2010

ASM Pacific Technology acquires Siemens Electronics Assembly Systems
Agreement with industrial investor

Siemens is selling its Siplace placement equipment business to ASM Pacific Technology Ltd., Hong Kong (ASMPT). Both companies have signed an agreement to that...

New Sales Manager in North America

Ovation Products has announced the appointment of Tony Du as its new Sales Manager for North America. The move is part of recent company restructuring in the...

Comments & Editorials
Dear Readers,

In my capacity as the new exhibition director, I am pleased to be able to give the starting signal for productronica 2011. A good twelve months before the...

Safety at work: corner solution for electronic production
Camera system as a protection

Manually fed assembly machines, partially automated manual workplaces, handling modules, bonders, or testing and inspection systems have achieved a high level...

New range of electro-chemicals

Amongst the many products on display, Electrolube showcase its newest cleaning product, Reflow Oven Cleaner, a specially formulated micro-emulsion for cleaning...

Specialized equipment and services will fulfil manufacturing challenges
Packaging as an Enabling Technology

Packaging has a much more important role in manufacturing semiconductors than in the past, according to Ignas van Dommelen, director of Development, Marketing...

Integration of components distributed in different heights in the PCB
Stencil technology in the third dimension

Modern PCBs with a high packing density and a mixture of SMD and THT components are constantly becoming more complex, increasing the demands placed on...

Challenges of PCB assembly system set-up for PoP
Innovative solutions

The increasing functionality and decreasing size of today’s consumer electronics has led to the development of the package-on-package (PoP) technology. Using...

Full Tunnel, or enclosed Tunnel Nitrogen is not effective
Covering the wave

Some companies claim that good quality wave soldering is only possible when using a totally enclosed Nitrogen atmosphere in the soldering machine. Pure physics...

More reliability thanks to black Dam&Fill encapsulants
Requirements on adhesives

Today, UV-curing chip encapsulants have become an accepted standard in many areas of electronics production. Their short curing times turn these adhesives into...

Test platform for mixed signal and system-on-chip semiconductor modules
Flexible and economical

The production costs of complex SoC semiconductor devices have fallen continually over recent years due to improvements in the manufacturing process and an...

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Titelbild EPP EUROPE Electronics Production and Test 11

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